ChipQuik Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T3 (35g syringe)

Chip Quik 991 Series Thermally Stable Solder Paste No-Clean Lead-Free SAC305 in 35g/10cc syringe with plunger and tips.

Revolutionary Formula: No Refrigeration Required!

Alloy: Sn96.5/Ag3.0/Cu0.5

Flux Type: Synthetic No-Clean

Flux Classification: REL0

Metal Content: 87% metal by weight.

Particle Size: T3 (25-45 microns)

Melting Point: 217C (423F)

Size: 35g/10cc syringe