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Xytronic HEI-IR860
HEI's Infra-Red Rework System |
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HEI-IR860
Complete IR Rework System
for SMD and BGA's |
| The
HEI-IR860 Solderlight is specially designed for SMD/BGA rework and
also very convenient for re-balling smaller BGA components. When
used in conjunction with our Infra-Red Pre-heater, the system will
achieve remarkable improvements in quality and efficiency of SMD/BGA
rework operations. |
|
Specifications for HEI-IR860 |
|
Solderlight Control |
|
Power Rating |
100-120Vac 60 hz |
220-240Vac 50 hz |
| Fuse |
T3.15A (Slow Type) |
T2A
(Slow Type) |
|
Output |
15Vac 150W |
| IR
Lamp Temp. range |
45º-450º
Celsius (113º-842º Fahrenheit) |
|
Time settings |
0-900sec |
|
Size (W*H*D) |
170 x 100 x 200mm
(6.7" x 3.94" x 7.9") |
| Net
weight |
7.25
lbs |
|
|
Pre-heater |
| Power Rating |
115 vac |
230 vac |
| Fuse (Delay type) |
T 10
A |
T 5
A |
| Output |
650W |
| Temperature range |
30º-350º
Celsius (86º-662º Fahrenheit) |
| Time
settings |
0-900sec |
| Size
(W*H*D) |
280 x 90 x 257mm
(11" x 3.5" x 10") |
| Net weight |
7.25
lbs |
|
|
Features of HEI-IR860 Front Panel |
 |
| 1. Timer Switch |
| 2. Power Switch for Solderlight |
| 3. "Down" key- Time counting & temperature
decrease |
| 4. "UP" key - Time counting &
temperature increase |
| 5. "SolderLight" - Temperature display (3
segment) IR Hand tool intensity. |
| 6.
Celsius (°)
temperature light for Solderlight |
| 7.
Fahrenheit (°)
temperature light for Solderlight |
| 8.
“RESET”- Offset frontward counting |
| 9.
“TIMER”- Time counting
display (3 segment)
Process timer |
13.
MODEL: Temperature offset pad |
| 10.
“ALARM”- Time setting |
14.
Fahrenheit (°) temperature light for PREHEAT |
| 11.
Temperature up pad (increase numerals) for PREHEAT |
15.
Celsius (°) temperature light for PREHEAT |
| 12.
Temperature down pad (decrease numerals) for PREHEAT |
16.
Temperature setting display (3 segment) |
|
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|
HEI-IR810 Back Panel |
|
 |
| 1.
Foot switch socket (4 pin)
|
| 2.
DC12V Cooling fan socket (3
pin) |
| 3.
Output to PRE-HEATER
|
| 4.
Fuse Holder
Solderlight connector
|
| 5.
AC power inlet
|
|
|
|
Benefits of the
HEI-IR810
1.
Quartz heater gets faster
heat-up time.
2.
The efficient pre-heat height
is 45mm from quartz surface to the bottom of the PCB assembly.
3.
The temperature of back heater
setting at 220C°
can get (75% energy is
provided by the back heater and 25% of the energy provided by the
top heater) efficient preheating performance and prevent the bending
and thermal stress of bigger PCBs and/or damage of the components just heating from the
top heater. |
|
Replacement Bulb and Accessories:
| |
HEI-Lamp
$107.50
|
| |
HEI-Lens
$39.00
|
|
|
| Questions and Answers: |
Q. What
Top Heat setting should you use?
A. Between 220-380C°.
Normal setting is 240C°
Q.
What’s the working distance of the IR Hand tool and how do I move it
for rework?
A. Approximately 5 – 10 mm when reworking and move up to 30mm
when removing Component – move the hand tool in a scanning motion to
heat leads, taking about one second for each scan of the component. Q.
What pre-heater setting should I use?
A. Between 200-290C°. Normal setting is 240C° Q.
How long do I preheat the PCB?
A. Always preheat the PCB (up to 120C°
for between 45 – 90 seconds) to allow the heat to conduct through to
the component before introducing the Top Heat. With the 700W
pre-heater the top of a small PCB will reach 120°
in approximately 45 – 90 seconds. Larger PCBs will take longer to
pre-heat. To check the PCB/component temperature, use a hand-held IR temperature sensor
(Not Supplied) to ‘look’ down at the PCB/component from about
60mm away and at about 45°
angle. |
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Howard Electronic Instruments, Inc. Address and Information
Copyright © 1996 - 2013 Howard Electronic Instruments, Inc. All rights reserved.
Current date CST:
06/20/2013
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