TechSpray Desoldering braid (wick) is pre-fluxed copper braid that is used to remove solder, which allows components to be replaced and excess solder to be removed. Techspray wick is available in static dissipative bobbins (except where indicated) for static sensitive environments. Techspray No-Clean wick is coated with proprietary flux that only leaves a slight clear residue, which does not cause service issues. Cleaning after using Techspray No-Clean wick is strictly optional.
Specifications: Meets or Exceeds MIL-F-14256; NASA NHB 5300, 4 (34-1); NASA NPC 200-4; NASA SP5002; 1821:HP 8690-0588; 1823: HP 8690-0577; IPC Standard-J-STD-004