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PDR
IR-X110
ELECTRONIC CONTROLLED HAND-HELD SMT
INFRA-RED REWORK SYSTEM
The PDR IR-X110 is a low
cost SMT rework system, using PDR’s patented IR Handtool technology that
has been specifically designed to cope with the challenges of repairing
today's PCB assemblies. No more blowing discrete components off of the
board. No air flow - Just good solid IR heat from top to bottom.
The PDR
IR-X110 and IR-X210 range of SMT/BGA rework systems, using PDR’s
patented IR Handtool technology have been specifically designed to
cope with the challenges of repairing today's PCB assemblies. The
systems benefit from al the proven attributes of PDR’s Focused IR
technology introduced in 1987 and used worldwide by over 3000
customers. They are extremely effective at soldering/desoldering SMT
or BGA components by hand and can achieve high yield rework at a very
low cost.
Both
systems feature PDR’s IR Handtool, 500W PCB Pre-heater and PDR’s WH450
Benchtop PCB Workholder.
The IR-X110 has a Type 1 power controller
with digital readout of power settings.
The IR-X210 benefits from
additional features including Type 2 power control with an built-in
CAL temperature controller, closed-loop temperature control,
non-contact component temperature monitoring and a hand-held vacuum
pick-up tool.
The PDR IR
handtool with closed-loop temperature control provides the extremely
high levels of process control necessary for the effective rework of
even the most advanced packages, including SMDs, BGAs, uBGAs, SMT
Connectors and Sockets without overheating the component, adjacent
components, or
the PCB.
Download Manual for
IR-X110 ---
Download Manual for
IR-X210
| Advanced
Features |
• PDR’s Focused IR Handtool - Component Heating System
• 500W IR - PCB Pre-heater
• Benchtop mounted PCB workholder (450mm)
• Choice of Digital Control Package - Type 1 or 2 (*)
• Closed-Loop Temperature Control of the SMT/BGA Component (*)
• Non-contact, IR Sensor for monitoring component temperature (*)
• Hand component pick-up with z-axis and rotation movements (*)
(*) = IR-X210 features only |
Reflow

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| Place and Align BGA |
Simple BGA Rework Procedure
Since it’s launch PDR’s Focused IR has been specified by three of
the world’s leading mobile phone manufacturers for reworking micro-BGA
components on their applications and is used widely throughout
Telecoms, Computer, Avionics, Automotive and Contract Manufacturing
industries.
The PDR IR-X110/210 products
bring the process controlled BGA rework capability of a
sophisticated system to the simplicity of a handtool. The customer
is able to simply and safely implement good process control for BGA/SMT
rework without the complexities and frustrations normally associated
with ‘high end’ rework systems.
IR-X110/210 Advantages Focused IR Heating
• Tool Free, Variable Focused IR Spot
- isolates component without tools or shields
- deep and tight access no problem
- safe on/near plastics
• Closed Loop Temperature Control
- real-time control
- instantly and precisely controllable
- instant process adjustments possible
- vital for good rework
Focused IR Heating
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• Non-contact IR Temperature Sensing
- active during soldering and
desoldering
- accurate measurement to +/- 1°C
- realtime closed-loop control
• Ergonomic Operation
- excellent observation and ergonomics
- allows easy operation of the equipment
• Safe And Effective
- proven world-wide since 1987 by 3000+
customers
- excellent on BGA/uBGA/future SMDs
- easy to understand, set and operate
Detailed Features
and Specifications
Advanced IR Handtool Component Heating
• Hand held Focused IR heating with dual
spot size
• 2 attachments with IR image of 7 or 14mm diameter
Large Area Back Heater System
• medium wave IR PCB preheating
• 500W
• Single zone (120mm x 120mm area)
450mm Portable benchtop mounted PCB
Workholder
• Up to 12” X 10” (300mm X 250mm) capacity
• Optional pcb ‘pallet’ providing macro-micro X-Y adjustments
Analogue/Digital Electronic Control
(IR-X110 only)
• Type 1, analogue/digital controller
• Simple dial setting power controls
• Digital readout of power settings
Digital, Closed-loop Electronic Control
(IR-X210 only)
• Type 2, digital controller
• Simple dial setting power controls
• CAL digital temperature controller - controls component
temperature
Non-contact, IR Sensor for measuring
component temperature (IR-X210 only)
• Manually adjustable, K-type non-contact IR
sensor
• Real time monitoring of component temperature throughout process
Hand held Vacuum Pick-up Tool (IR-X210
only)
• Additional electric powered, hand held vacuum
tool with silicon cups
Benchtop
Technical Specifications
| • Topheat power |
- 150 watts IR |
| • Backheater power |
- 500watts IR |
| • Voltage/frequency |
- 110/240 volts 50/60Hz |
| • Typical components |
- BGAs, micro-BGAs,
QFPs, PLCCs, SOICs, small SMDs |
| • Bench area required |
- 450mm x 600mm- |
| • Weight |
- 25 Kg |
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Copyright © 1996 - 2008 Howard Electronic Instruments, Inc. All rights reserved.
Revised: 07/14/2008
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