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PDR IR-X110

ELECTRONIC CONTROLLED HAND-HELD SMT INFRA-RED REWORK SYSTEM
The PDR IR-X110 is a low cost SMT rework system, using PDR’s patented IR Handtool technology that has been specifically designed to cope with the challenges of repairing today's PCB assemblies. No more blowing discrete components off of the board. No air flow - Just good solid IR heat from top to bottom.

No Longer Available PDR IR-X110    

PDR IR-X210 No longer available

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The PDR IR-X110 and IR-X210 range of SMT/BGA rework systems, using PDR’s patented IR Handtool technology have been specifically designed to cope with the challenges of repairing today's PCB assemblies. The systems benefit from al the proven attributes of PDR’s Focused IR technology introduced in 1987 and used worldwide by over 3000 customers. They are extremely effective at soldering/desoldering SMT or BGA components by hand and can achieve high yield rework at a very low cost.

Both systems feature PDR’s IR Handtool, 500W PCB Pre-heater and PDR’s WH450 Benchtop PCB Workholder.
The IR-X110 has a Type 1 power controller with digital readout of power settings.
The IR-X210 benefits from additional features including Type 2 power control with an built-in CAL temperature controller, closed-loop temperature control, non-contact component temperature monitoring and a hand-held vacuum pick-up tool.

The PDR IR handtool with closed-loop temperature control provides the extremely high levels of process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, uBGAs, SMT Connectors and Sockets without overheating the component, adjacent components, or the PCB.

Download Manual for IR-X110  ---  Download Manual for IR-X210

Advanced Features
• PDR’s Focused IR Handtool - Component Heating System
• 500W IR - PCB Pre-heater
• Benchtop mounted PCB workholder (450mm)
• Choice of Digital Control Package - Type 1 or 2 (*)
• Closed-Loop Temperature Control of the SMT/BGA Component (*)
• Non-contact, IR Sensor for monitoring component temperature (*)
• Hand component pick-up with z-axis and rotation movements (*)
(*) = IR-X210 features only
Reflow
Place and Align BGA

Simple BGA Rework Procedure
Since it’s launch PDR’s Focused IR has been specified by three of the world’s leading mobile phone manufacturers for reworking micro-BGA components on their applications and is used widely throughout Telecoms, Computer, Avionics, Automotive and Contract Manufacturing industries.

The PDR IR-X110/210 products bring the process controlled BGA rework capability of a sophisticated system to the simplicity of a handtool. The customer is able to simply and safely implement good process control for BGA/SMT rework without the complexities and frustrations normally associated with ‘high end’ rework systems.


IR-X110/210 Advantages Focused IR Heating

• Tool Free, Variable Focused IR Spot
- isolates component without tools or shields
- deep and tight access no problem
- safe on/near plastics
• Closed Loop Temperature Control
- real-time control
- instantly and precisely controllable
- instant process adjustments possible
- vital for good rework

Focused IR Heating
• Non-contact IR Temperature Sensing
- active during soldering and desoldering
- accurate measurement to +/- 1°C
- realtime closed-loop control
• Ergonomic Operation
- excellent observation and ergonomics
- allows easy operation of the equipment
• Safe And Effective
- proven world-wide since 1987 by 3000+ customers
- excellent on BGA/uBGA/future SMDs
- easy to understand, set and operate

Detailed Features and Specifications

Advanced IR Handtool Component Heating
• Hand held Focused IR heating with dual spot size
• 2 attachments with IR image of 7 or 14mm diameter
Large Area Back Heater System
• medium wave IR PCB preheating
• 500W
• Single zone (120mm x 120mm area)

450mm Portable benchtop mounted PCB Workholder
• Up to 12” X 10” (300mm X 250mm) capacity
• Optional pcb ‘pallet’ providing macro-micro X-Y adjustments

Analogue/Digital Electronic Control (IR-X110 only)
• Type 1, analogue/digital controller
• Simple dial setting power controls
• Digital readout of power settings

Digital, Closed-loop Electronic Control (IR-X210 only)
• Type 2, digital controller
• Simple dial setting power controls
• CAL digital temperature controller - controls component temperature

Non-contact, IR Sensor for measuring component temperature (IR-X210 only)
• Manually adjustable, K-type non-contact IR sensor
• Real time monitoring of component temperature throughout process
Hand held Vacuum Pick-up Tool (IR-X210 only)
• Additional electric powered, hand held vacuum tool with silicon cups

 

Benchtop Technical Specifications

• Topheat power - 150 watts IR
• Backheater power - 500watts IR
• Voltage/frequency - 110/240 volts 50/60Hz
• Typical components - BGAs, micro-BGAs, QFPs, PLCCs, SOICs, small SMDs
• Bench area required - 450mm x 600mm-
• Weight - 25 Kg
 
 
Howard Electronic Instruments, Inc.
974 SE Pioneer Rd
El Dorado, KS 67042
1-800-394-1984 Toll Free (USA and Canada)
316-321-2800 Local
01-316-321-2800 International Phone
316-321-2803 Fax

 

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