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THE REPAIR PROCESS
Using the JBC AM6850 AM6850SMD or AM7000SMD Rework Station
desoldering the IC with hot air cleaning the pads with desoldering tool Positioning the component with vacuum pick
Desoldering the IC component with hot-air and vacuum extractor. Cleaning the pads with the thru-hole desoldering iron. Positioning the component with the vacuum pick.
solder tack corners of IC component flux the leads of IC soldering IC with special tip
Tack solder two opposite corners of the component being careful to have exact placement of the IC. Use microscope HEI-MP4-FR or HEI-VM-LCD Flux the IC pads and leads with flux. I recommend a good gel flux such as NC559V2 No-Clean Gel Flux in a 10CC Syringe. Soldering the leads with the special tips for soldering SMDs. Simply let if float over the leads with no downward pressure on the leads.

The very fast recovery time of the JBC soldering iron allows for perfect low temperature soldering of IC's and components.


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