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• Z-Axis:  The Z-Axis control adjusts the height of the nozzle above the solder points to be re-flowed.  
• PC Board Stand-Off:  The PC Board Stand-Off's have a magnetic strip on the bottom to adhere to the moving plate or the stationary plate while holding PC Board securely in place. 
• PCB Stand-Off:  Stand-Off is magnetized on bottom side and pointed on top side for holding in a populated area of board. 
• Vacuum Pic:  While holding finger over vent hole, apply vacuum pic to top of IC to be removed,  thereby lifting IC from board with vacuum generated from vacuum pump contained inside unit. 
• PC Board Holding Fixture:  The holding fixture incorporates felt on the bottom for ease of sliding on metal plate. Slide for easy alignment of component under the Hot-Air-Nozzle either before or after the X-Y adjustment. 
• Metal Block:  Block for holding PC Board Holding Fixture at the right height for sliding off of SC3000 main frame. 

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• Mode:  The mode switch switches to the respective modes. 

  • PGA/BGA: This mode is for removing BGA's. The X-Axis adjusts the inside square of the BGA  and the Y-Axis adjusts the outside square of the BGA. After the HEATon button is pushed, the nozzle performs the X-Axis square, then increases the square size with every revolution until it reaches the Y-Axis size. Then is returns to the X-Axis size and repeats the process until the BGA is removed with the vacuum pic by the operator. 
  • QFP/PLCC Standard:  In this mode the X-Axis adjusts the width of the component to be removed and the Y-Axis adjusts the length of the component. This mode also has high air flow (12 Liter/Min.) and high temperature (depending on the temperature adjustment). 
  • LOW:  This mode is the same as the standard mode except that in has a low air flow(6 Liter/Min.) and lower temperature (depending on the temperature adjustment). This mode is used for heavily populated boards so small chips won't accidentally be blown from the board during reflow. 
  • SLOW:  This mode is used for replacing the QFP/PLCC etc. after old solder has been removed from pads and new solder paste has been applied to the new component to be re-flowed. The temperature knob controls the temperature of the air flow while the nozzle is moving very slow around the solder points of the component. Usually two and one half revolutions are all that are necessary to achieve reflow. 

• START:  Pushing the start button the first time starts the nozzle rotating to allow adjustment of the width and length of the nozzle. After adjustment is complete, pushing the start button a second time starts the air flow, heat and timer. 
• STOP:  Pushing the stop button at any time will stop the heat and raise the nozzle approximately one half inch to allow vacuum picking the component from the PC board. Pushing the stop button again will place the unit in the cool down mode where room air is blown through the nozzle until it reaches ambient air temperature. If the timer is set to the proper time required to achieve solder melt temperature at the component, then the process is microprocessor controlled and the stop button is not needed. 
• Timer:  The timer, (if used) is set to the time required to reach solder melt temperature after the start button is pushed two times. At the end of the time cycle, the units automatically goes into it's cool down cycle and shuts off after reaching it's cool down temperature. If the timer is not used, turn to a full 5 minutes and use the stop button to end the heating cycle. 
• TEMP:  This control is used to control the temperature of the heater in all modes. Normal standard mode temperature is full on, but is fully adjustable at the discretion of the operator. All other modes are fully adjustable by the operator. 
• KNOB X-AXIS:  This knob is used to adjust the nozzle width of the component to be re-flowed. It is also used as the inside adjustment for BGA/PGA removal. 
• KNOB Y-AXIS:  This knob is used to adjust the nozzle length of the component to be re-flowed. It is also used as the outside adjustment for BGA/PGA removal. 
• KNOB Z-AXIS:  This is used to adjust the distance from the solder points of the component to the tip of the nozzle. 
• NOZZLE:  The nozzle is adjusted by the X-Y & Z Axis knobs to whirl around the solder points of the component to be removed. Holes in the nozzle allow the operator to visually inspect the temperature of the heater according to the color of the heater coils. 

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