This
equipment is for any size and shape of QFP, SOP, PLCC, PGA, BGA, Connector, etc. to remove
and/or reflow (Solder) without changing the nozzle head.
Hot air blows out from a single nozzle which traces along the soldered points the SMD.
X and Y axis trace range of the nozzle is 0~50mm and you can set it at any length within
that range.
Also by changing the mode, you can use this equipment for many different kinds of
operationsClick
for Much More Information
Larger View and Drawing of Front Panel.
|
- Able to handle all SMD's up to 50mm square without
changing nozzle head.
- Able to remove PGA and BGA of up to 50mm square
without changing nozzle head.
- Able to take connector out.
- Able to use for reflow of QFP, BGA, etc.
- Built-in timer enables to prevent damage of PCB
and nearby parts caused by overheating.
- Anybody can use this equipment without failure
because it is automated by a micro-processor.
- Light weight and compact.
- The lowest price in the industry.
|
|
Download manual in PDF format (19Mb)
|
| Specifications |
| Style |
Hot air blowing style
Blowing nozzle : 350W @ 4mm |
| Airpump |
Vacuum Pump Built-In |
| Nozzle Trace Range |
X-Y = 0~50mm Z=25mm |
| Temperature Control |
Adjustable by knob on front panel |
| Timer Control |
Adjustable by knob on front panel
Maximum 5 minutes |
Size of board
to process |
Y Direction 420mm
X Direction No Limit |
| Mode |
4 Modes STD, Low, Slow PGA/BGA |
| Dimensions |
W 300mm H 310mm D 450mm |
| Weight |
9 Kg's |
| Airflow Rate |
Low - Slow 6 Liter/Min
Std. PGA/BGA 12 Liter/Min. |
|