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NO-CLEAN LOW RESIDUE SOLDER WIRE
Technical Data Sheet
________________________________________________________________________________________________________
DESCRIPTION
Amtech No-Clean solder wire is a low residue flux core
solder, designed for hand
soldering and re-work applications. The core provides sufficient activity to
solder
successfully to bare copper and other hard to solder surfaces. The blend of
resin and
polymer dendrimer activator provides rapid wetting, with a clear
non-corrosive residue.
_ _____________________________________________________________________________
PHYSICAL PROPERTIES
STANDARD ALLOYS: Sn63/Pb37, Sn96/Ag4, Sn95/Ag5
STANDARD ROLL SIZE: 1 LB. or .22 lb. for finer diameters
FLUX PERCENTAGE: 2%
STANDARD DIAMETERS: .010, .015, .020, .025, .031
____________________________________________________________________________
Test Results
HALIDE CONTENT_______________________________Passes Silver
Chromate Paper Test
CORROSIVENESS_______________________________ Passes Copper
Mirror Test
ELECTROMIGRATION____________________________Passes Bellcore
visual and
Electrical requirements
SIR OHMS (7 DAYS @ 85C-85% R.H.)________________10 10
Bellcore TR-NWT-000078 _________________________ Meets
Requirements
Ansi/J-STD-004__________________________________ Meets
Requirements
SAFETY
SEE THE MATERIAL SAFETY DATA SHEET FOR THE APPROPRIATE
SAFETY PROCEDURES.
PACKAGING
STANDARD 1 LB. SPOOLS.
STORAGE
THE EXPECTED SHELF LIFE IS AT LEAST 12 MONTHS WHEN STORED IN
NORMAL CONDITIONS.
The information contained herein is based on technical data
which we believe to be reliable and is intended for use by persons
having TECHNICAL SKILL, at their own risk. Users of our
products should make their own tests to determine the suitability of each
such product for their own particular process. AMTECH will
assume no liability for results obtained or damages incurred through the
application of the data presented.
No-Clean Wire TDS Rev C.10/00
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Copyright © 1996 - 2009 Howard Electronic Instruments, Inc. All rights reserved.
Revised: 06/24/2009
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