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No
Clean Low Residue Wire Solder |
Amtech's No-Clean Core Wire was
developed to provide outstanding wetting-speed and solder joint quality
without affecting the solder joint cosmetics.
The technology used in our
solder wire is unparalleled in reliability, reproducibility and
environmental awareness. The secret to this high level performance is the
thermodynamic activity of the product, which is primarily a physical energy
released by the conduction-heat of the soldering iron and physical
disturbance of the core media.
This product is available in
63/37, 62/36/2 & Lead Free alloys made from metals that meet or exceed the
J-STD-006. It also meets Bellcore and IPC requirements. Standard diameters
are listed below but other diameters and alloys are available on request.
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Physical Properties: |
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Standard Alloys |
Sn63/Pb37,
Sn62/Pb36/Ag2, Sn96/Pb4 |
| Standard Roll
Size |
1 LB |
| Flux Percentage |
1% |
| Standard
Diameters |
.010, .015, .020,
.031, .040, .062 |
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| Test to
ANSI/IPC-J-STD-004 |
Results |
| Copper Mirror |
Pass |
| Silver Chromate
Paper |
Pass |
| Corrosion |
Pass |
| SIR OHSM (7 Days
@ 85șC-85% R.H.) |
1010 |
Safety:
See the material safety data sheet for the
appropriate safety procedures.
Storage:
The expected shelf life is at least 12 months when stored in normal
conditions.
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